Presentation 3
ＶＬＳＩの記述。
A Novel Self-assembly Technology For Next Generation Interconnects in VLSI Devices
Dr. Miron Hazani
Bionnections
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Bionnections - A novel self-assembly technology for next generation interconnects in VLSI devices
Miron Hazani - Prologue Technological Entrepreneurship As the size of communication, data storage, and data handling devices decreases, and their complexity and array size increase, it becomes increasingly difficult and costly to produce such devices using conventional techniques. In addition to the difficulties related to implementing top-down approaches, new challenges relating to dielectric breakdown, heat dissipation, increased resistance and susceptibility to EM failure arise as the technology progresses to ever smaller dimensions. As the feature size approaches 22nm, which is expected at the beginning of the next decade, fundamental physical limitations are expected to render the existing top-down approaches to semiconductor manufacturing extremely challenging and costly. While novel techniques are being proposed as solutions to the front-end challenges (transistor production), the back-end (conducting interconnects) problem remains mostly unresolved.
Bionnection’s technology addresses these major issues by introducing a new type of conducting nano-wire, having improved characteristics with respect to heat dissipation and durability to electromigration failure, as well as having the capacity of being easily positioned at pre-determned locations through a unique patent-pending self-assembly scheme. With its hybrid approach, where the front-end remains based based on existing Silicon technology, Bionnections protects large capital investments of semiconductor manufactures, and aims at providing a seamless path for the continued growth of the semiconductor industry according to Moore’s law.
